深圳精科裕隆电子有限公司

深圳精科裕隆电子有限公司

0755-27338957

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    FPC process capability

    Process capability

    Project Content Remarks
    Product process 1-12 layer board /fpc flexible circuit board, soft and hard combination board, tinplate, gold-plated board, gold-plated board
    Maximum size of plate 250mm*700mm
    Maximum plate thickness 0.45±0.05
    Minimum plate thickness 0.051~0.185 ±0.03
    Thickness of base material copper foil 1/3oz、1/2oz、1oz
    Minimum aperture Finished aperture:0.08mm
    Minimum line width and line spacing Minimum line width:0.05mm、Minimum line spacing:0.05mm
    Tolerance Wire hole ± 10%, hole diameter +3mil, shape ± 0.05mm
    Coating thickness Gold plated plate: Ni layer thickness: 1-6um, Au layer thickness: 0.03-0.1um"              
    Gold plate: thickness of Ni layer: 1-6um, thickness of Au layer: 0.03-0.2um“
     Tinplate: SN layer thickness: 8-25um


     
    Application scope of substrate

    Category Brand Specifications Place of Origin
    Base material Xinyang / Shengyi Adhesive free substrate, halogen-free Taiwan
    Substrate / covering film Tai Hong Adhesive base material, adhesive free base material, halogen-free Taiwan
    Substrate / covering film Generous and benevolent Adhesive base material, halogen-free Taiwan
    Substrate / covering film Yasen Adhesive base material, adhesive free base material, halogen-free Taiwan
    Gummed paper 3M 3M9077、9460、467、468 U.S.A
    Gummed paper Ridong 5919 high temperature resistance Japan
    Gummed paper SONY D3410 heat curing adhesive Japan

     
    Process capability

    Project Technical capability Project Tolerance
    Number of layers 1-12 layers of FPC (2-12 layers of soft and hard bonding plate) Lamination tolerance of covering film ±0.2mm
    Maximum mosaic size 250*900mm (500*1200mm special) PI reinforcement includes FR4 ±0.2mm
    Minimum aperture 0.1mm Punching burr of covering film ≤0.1mm
    Bottom copper thickness 12um/18um/35um/70um Electromagnetic film alignment tolerance ±0.35mm
    Insulation thickness 12.5um/25um/50um Steel sheet reinforcement tolerance 0.1mm
    Minimum plate thickness 0.09 Misalignment tolerance between reinforcing plate hole and FPC hole ≤0.05mm
    Minimum line width and line spacing 0.045 Drilling tolerance ≤0.02mm
    Line tolerance ±0.02mm Thickness tolerance of single panel gold deposit 1-2um
    Profile tolerance (edge to edge) Precision mold ± 0.05mm/ ordinary mold ± 0.1mm Thickness tolerance of single panel nickel deposition 0.025-0.075um
    Nickel gold plating thickness 1-3um Thickness tolerance of gold deposit of double-sided plate 2-3um
    Thickness of chemical precipitation nickel gold 0.02-0.075um Thickness tolerance of gold and nickel on double-sided plate 0.025-0.075um
    Wire to profile edge 0.05mm Tolerance of etched steel sheet ±0.03mm
    Thickness of electroplated pure tin 1-15um Tolerance of punching steel sheet ±0.05mm