PCB Process Capability

Project	Project name	Process Capability
Overall process capability	Layers	1-30 layers
	High Frequency Hybrid HDI	Ceramic materials and PTFE materials can only be mechanically drilled for blind buried holes, controlled depth drilling, back drilling, etc. (laser drilling is not allowed, and copper foil cannot be directly pressed)
	High-speed HDI	Made as regular HDI
	Laser order	Levels 1-5 (≥6 levels require review)
	Plate thickness range	0.1-5.0mm (less than 0.2mm, more than 6.5mm to be reviewed)
	Minimum finished product size	Veneer 5*5mm (less than 3mm to be reviewed)
	Maximum finished product size	2-20 floors 21*33inch; Note: if the short edge of the board edge exceeds 21inch, it needs to be reviewed.
	Maximum finished copper thickness	Outer layer 8oz (larger than 8oz to be reviewed), inner layer 6oz (larger than 6oz to be reviewed)
	Minimum finished copper thickness	1/2oz
	Interlayer alignment	≤3mil
	Through hole filling range	Plate thickness ≤ 0.6mm, hole diameter ≤ 0.2mm
	Thickness range of resin plug orifice plate	0.254-6.0mm, PTFE plate resin plug hole needs to be reviewed.
	Plate thickness tolerance	Plate thickness ≤ 1.0mm; ±0.1mm
	Plate thickness tolerance	Plate thickness ＞ 1.0mm; ±10%
	Impedance tolerance	±5Ω（＜50Ω），±10%（≥50Ω）； ± 8% (≥ 50 Ω, to be reviewed)
	Warpage	Routine: 0.75%, limit: 0.5% (to be reviewed) maximum: 2.0%
	Pressing times	Pressing of the same core plate ≤ 5 times (more than 3 times need to be reviewed)
Material type	Ordinary TG FR4	Shengyi S1141, Jiantao kb6160a, Guoji gf212
	Medium TG FR4	Shengyi s1150g (medium TG plate), Jiantao kb6165f, Jiantao kb6165g (halogen free)
	High Tg FR4	Shengyi s1165 (halogen-free), Jiantao kb6167g (halogen-free), Jiantao kb6167f
	Aluminum substrate	Guoji gl12, clear cs-al-88/89 ad2, Juqin jq-143 1-8 mixed pressure FR-4
	Type of material used for HDI board	Ldpp (it-180a 1037 and 1086), general 106 and 1080
	High CTI	Shengyi s1600
	High Tg FR4	Isola：FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR；联茂：IT-180A、 IT-150DA； Nelco：N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI；松下:R-5775K（Megtron6）、R-5725（Megtron4）；建滔：KB6167F；台光：EM-827；宏仁：GA-170；南亚：NP-180；台耀：TU-752、TU-662；日立：MCL-BE-67G（H）、MCL-E-679（W）、 MCL-E-679F（J）；腾辉：VT-47；
	Ceramic powder filled high frequency materials	Rogers：Rogers4350、Rogers4003;Arlon:25FR、25N;
	Polytetrafluoroethylene high frequency material	Rogers series、Taconic series、Arlon series、Nelco series、TP series
	PTFE semi cured sheet	Taconic：TP series、TPN series、HT1.5(1.5mil)、Fastrise series
	Mixed pressure of materials	Rogers、Taconic、Arlon、Nelco and FR-4
Metal substrate	Number of layers	Aluminum substrate and copper substrate: 1-8 layers; Cold plate, sintered plate, embedded metal plate: 2-24 layers; Ceramic plate: 1-2 layers;
	Finished product size (aluminum substrate, copper substrate, cold plate, sintered plate, embedded metal plate)	MAX:610610mm、MIN:55mm
	Maximum production size (ceramic plate)	100*100mm
	Finished plate thickness	0.5-5.0mm
	Copper thickness	0.5-10 OZ
	Metal base thickness	0.5-4.5mm
	Metal based material	AL：1100/1050/2124/5052/6061；Copper：Red copper pure iron
	Minimum finished hole diameter and tolerance	NPTH：0.5±0.05mm；PTH(Aluminum substrate, copper substrate)：0.3±0.1mm；PTH(Cold plate, sintered plate, embedded metal plate)：0.2±0.10mm；
	Profile machining accuracy	±0.2mm
	Surface treatment process of PCB part	Lead / non lead tin spraying; OSP； Nickel (palladium) gold precipitation; Electric (nickel) soft / hard gold; Electroplated tin; Nickel free electroplating of soft and hard gold; Thick gold production
	Metal surface treatment	Copper: nickel plated gold; Aluminum: anodic oxidation, hard oxidation, chemical passivation; Mechanical treatment: dry sand blasting and wire drawing.
	Metal based materials	Quanbao aluminum substrate (T-110, t-111); Tenghui aluminum substrate (vt-4a1, vt-4a2, vt-4a3); Laird aluminum substrate (1ka04, 1ka06); Bages metal substrate (mp06503, ht04503); Taconic metal substrate (tly-5, tly-5f);
	Thickness of thermal conductive adhesive (dielectric layer)	75-150um
	Size of buried copper block	33mm—7080mm
	Flatness of buried copper block (drop accuracy)	±40um
	Distance from buried copper block to hole wall	≥12mil
	Thermal conductivity	0.3-3W/m.k（Aluminum substrate, copper substrate, cold plate）；8.33W/m.k（Sintered plate）；0.35-30W/m.k（Buried metal plate）；24-180W/m.k（Ceramic plate）；
Product type	Rigid plate	Backplane, HDI, multilayer buried blind hole, thick copper plate, thick copper for power supply, semiconductor test board
Stacking mode	Multiple pressing blind buried orifice plate	Pressing on the same side ≤ 3
Stacking mode	HDI board type	1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (embedded hole in n ≤ 0.3mm), laser blind hole can be electroplated and filled
Local mixed pressure	Minimum distance from mechanical drilling to conductor in local mixed pressure area	≤ 10 layers: 14mil; 12 floors: 15mil; ＞ 12th floor: 18mil
Local mixed pressure	Minimum distance from local mixed pressure junction to borehole	≤ 12 layers: 12mil; ＞ 12th floor: 15mil
Surface treatment	Unleaded	Electroplating copper nickel gold, gold precipitation, hard gold plating (with / without nickel), gold finger, lead-free tin spraying, OSP, chemical nickel palladium, soft gold plating (with / without nickel), silver precipitation, tin precipitation, enig+osp, enig+g/f, full plate gold plating +g/f, silver precipitation +g/f, tin precipitation +g/f
	Lead	Lead spray tin
	Thickness diameter ratio	10: 1 (lead / lead-free tin spraying, chemical precipitation of nickel gold, silver, tin, chemical nickel palladium); 8：1（OSP）
	Machining dimension (max)	Gold deposition: 520800mm, vertical tin deposition: 500600mm, horizontal tin deposition: less than 500mm on one side; Horizontal silver deposition: less than 500mm on one side; Lead / lead-free tin spraying: 520650mm; OSP: single side less than 500mm; Electroplated hard gold: 450500mm; One side is not allowed to exceed 520mm
	Machining dimension (min)	Tin deposition: 6080mm; Silver deposit: 6080mm; Lead / lead-free tin spraying: 150230mm; OSP：6080mm； At the surface of the walking board less than the above size
	Thickness of processed plate	Gold sinking: 0.2-7.0mm, tin sinking: 0.3-7.0mm (vertical tin sinking line), 0.3-3.0mm (horizontal line); Silver deposit: 0.3-3.0mm; Lead / lead-free tin spraying: 0.6-3.5mm; Tin spray plates below 0.4mm need to be reviewed and manufactured; OSP：0.3-3.0mm； Electroplated hard gold: 0.3-5.0mm (plate thickness ratio 10:1)
	Minimum spacing between IC of gold plate or pad to line	3mil
	Maximum height of golden finger	1.5inch
	Minimum spacing between golden fingers	6mil
	Minimum segment spacing of segmented golden finger	7.5mil
Surface coating thickness	Tin spraying	2-40um (the thinnest thickness of the large tin surface with lead spraying is 0.4um, and the thinnest thickness of the large tin surface without lead spraying is 1.5um)
	OSP	Film thickness: 0.2-0.4um
	Chemical precipitation of nickel and gold	Nickel thickness: 3-5um; Gold thickness: 1-3uinch, ≥ 3uinch needs to be reviewed
	Chemical precipitation of silver	6-12uinch
	Chemical precipitation of tin	Tin thickness ≥ 1um
	Electroplate hard gold	2-50uinch
	Electroplated soft gold	Gold thickness 0.10-1.5um (dry film plating process), gold thickness 0.10-4.0um (non dry film plating process)
	Chemical nickel palladium	NI:3-5um，Pd：1-6uinch，Au：1-4uinch
	Electroplating copper nickel gold	The thickness of gold is 0.025-0.10um, the thickness of nickel is ≥ 3um, and the thickness of base copper is 1oz at most
	Gold finger nickel plated gold	Gold thickness 1-50uinch (the required value refers to the thinnest point), Nickel thickness ≥ 3um
	Carbon oil	10-50μm
	Green oil	Copper cover oil (10-18um), through hole cover oil (5-8um), line corner ≥ 5um (primary printing, copper thickness less than 48um)
	Blue gum	0.20-0.80mm
Drill hole	Maximum plate thickness of 0.1/0.15/0.2mm mechanical drilling	0.8mm/1.5mm/2.5mm
	Minimum laser drilling hole diameter	0.1mm
	Maximum laser drilling aperture	0.15mm
	Mechanical hole diameter (finished product)	0.10-6.2mm (corresponding to drilling tool 0.15-6.3mm)
		The minimum finished hole diameter of PTFE material (including mixed pressure) plate is 0.25mm (corresponding to drill tool 0.35mm)
		Hole diameter of mechanical buried blind hole ≤ 0.3mm (corresponding to drilling tool 0.4mm)
		Hole diameter of green oil plug hole in disc hole ≤ 0.45mm (corresponding to drill tool 0.55mm)
		The minimum hole diameter of connecting hole is 0.35mm (corresponding to 0.45mm of drilling tool)
		The minimum diameter of metallized half hole is 0.30mm (corresponding to 0.4mm of drilling tool)
	Maximum thickness diameter ratio of through-hole plate	20: 1 (excluding tool diameter ≤ 0.2mm; > 12:1 to be evaluated)
	Maximum ratio of laser drilling depth to aperture	1：1
	Mechanical depth control drill has the largest blind hole depth to hole diameter ratio	1.3:1 (aperture ≤ 0.20mm), 1.15:1 (aperture ≥ 0.25mm)
	Minimum depth of mechanical depth control drill (back drill)	0.2mm
	Drilling - minimum distance from mechanical drilling to conductor (non buried blind hole plate and first-order laser blind hole)	5.5mil (≤ 8 layers); 6.5mil（10-14）； 7mil (> 14 floors)
	Drilling - minimum distance from mechanical drilling to conductor (mechanical buried blind hole plate and second-order laser buried blind hole)	7mil (primary pressing); 8mil (secondary pressing); 9MIL (three times of pressing)
	Drilling - minimum distance from mechanical drilling to conductor (laser blind hole)	7mil（1+N+1）； 8mil (1+1+n+1+1 or 2+n+2)
	Drilling - minimum distance from laser drilling to conductor (1st and 2nd order HDI board)	5mil
	Drilling - minimum distance between hole walls of different networks (after compensation)	10mil
	Drilling - minimum distance between the hole walls of the same network (after compensation)	6mil(通孔；激光盲孔)；10mil（机械盲埋孔）
	Drilling - minimum distance between non-metallic hole walls (after compensation)	8mil
	Drilling hole position tolerance (compared with CAD data)	±2mil
	Drilling - minimum tolerance of npth hole diameter	±2mil
	Drilling - hole diameter accuracy of solderless devices	±2mil
	Drilling - taper hole depth tolerance	±0.15mm
	Drilling - taper hole orifice diameter tolerance	±0.15mm
Pad (ring)	Minimum size of inner and outer pads of laser hole	10mil (4mil laser hole), 11mil (5MIL laser hole)
	The size of inner and outer pads of mechanical via is the smallest	16mil (8mil aperture)
	BGA pad diameter minimum	There are lead tin spraying process 10mil, lead-free tin spraying process 12mil, and other processes 7mil
	Pad tolerance (BGA)	+/-1.2mil (pad ＜ 12mil)+/- 10% (pad ≥ 12mil)
Line width / spacing	Limit line width corresponding to copper thickness
		1/2OZ：3/3mil
		1OZ: 3/4mil
		2OZ: 5/5mil
		3OZ: 7/7mil
		4OZ: 12/12mil
		5OZ: 16/16mil
		6OZ: 20/20mil
		7OZ: 24/24mil
		8OZ: 28/28mil
		9OZ: 30/30mil
		10OZ: 32/30mil
	Line width tolerance	≤10mil：+/-1.0mil
	Line width tolerance	＞10mil：+/-1.5mil
Solder resist character	Maximum drilling diameter of resistance welding plug hole (cover oil on both sides)	0.5mm
	Solder resist ink color	Green, yellow, black, blue, red, white, purple, matte green, matte oil black, high refraction white oil
	Character ink color	White, yellow, black
	Maximum diameter of blue glue aluminum plug hole	5mm
	Resin plug hole drilling hole diameter range	0.1-1.0mm
	Maximum thickness diameter ratio of resin plug hole	12：1
	Minimum width of resistance welding Bridge	Special requirements for green oil 4mil and variegated 6mil controlled solder bridge
	Minimum character line width	White characters 3mil high 24mil; Black character 5MIL high 32mil
	Minimum spacing of hollow words	Hollow width 8mil height 40mil
	Solder mask hollow word	Hollow width 8mil height 40mil
appearance	Distance from the center line of V-CUT without copper leakage to the figure	H ≤ 1.0mm:0.3mm (20 ° refers to the angle of V-shaped incision), 0.33mm (30 °), 0.37mm (45 °);
		1.0＜H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°);
		1.6＜H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°);
		2.4＜H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°);
	V-CUT symmetry tolerance	±4mil
	The number of V-CUT lines is the largest	100
	V-CUT angle tolerance	± 5 degrees
	V-CUT angle specification	20、30、45 degrees
	Chamfer angle of golden finger	20、30、45 degrees
	Chamfer angle tolerance of gold finger	±5degrees
	The minimum distance between tab and golden finger without falling injury	6mm
	Minimum distance between the side of golden finger and the contour edge line	8mil
	Depth accuracy (npth) of deep milling groove (edge)	±0.10mm
	Overall dimension accuracy (edge to edge)	±8mil
	Minimum tolerance of milling groove hole (PTH)	Groove width and groove length are ± 0.15mm
	Minimum tolerance of milling groove and hole (npth)	Groove width and groove length are ± 0.10mm
	Minimum tolerance for slotted holes (PTH)	Groove width direction ± 0.075mm; Slot length / slot width < 2: Groove length direction +/-0.1mm; Slot length / slot width ≥ 2: slot length direction +/-0.075mm
	Minimum tolerance for slotted holes (npth)	Groove width direction ± 0.05mm; Slot length / slot width < 2: Slot length direction +/-0.075mm; Slot length / slot width ≥ 2: slot length direction +/-0.05mm