深圳精科裕隆电子有限公司
0755-27338957
Double sided gold deposit Surface treatment: HDI immersion gold + electro-gold Goldfinger 3U
Layers:8 Surface treatment: HDI immersion gold + electro-gold Goldfinger
Layers:6 Surface treatment: immersion gold + electro-gold Goldfinger 15U
Layers:6 Surface treatment: immersion gold + electro-gold Goldfinger BGA(Ball Grid Array) Minimum aperture: 0.2MM
Layers:4 Surface treatment: immersion gold + electro-gold Goldfinger 5U