深圳精科裕隆电子有限公司
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Double sided gold deposit Surface treatment: HDI immersion gold + electro-gold Goldfinger 3U

Layers:8 Surface treatment: HDI immersion gold + electro-gold Goldfinger

Layers:6 Surface treatment: immersion gold + electro-gold Goldfinger 15U

Layers:6 Surface treatment: immersion gold + electro-gold Goldfinger BGA(Ball Grid Array) Minimum aperture: 0.2MM

Layers:4 Surface treatment: immersion gold + electro-gold Goldfinger 5U