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FR4-TG135 circuit board
Surface treatment method：lead free laminate：2L dielectric constant：4.3 thickness：1.6MM Outer copper foil thickness：2oz ...
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FR4-TG150 circuit board
Surface treatment method：lead free laminate：4L dielectric constant：4.3 thickness：1.6MM Outer copper foil thickness：1oz ...
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FR4-TG150 circuit board
Surface treatment method：lead free laminate：4L dielectric constant：4.3 thickness：1.6MM Outer copper foil thickness：1oz ...
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FR4-TG150 circuit board
Surface treatment method：lead free laminate：2L dielectric constant：4.3 thickness：1.6MM Outer copper foil thickness：2oz ...
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Ceramic 3006
Material：Ceramics Double panel
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Ceramic 3003
Material：Ceramics Double panel
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Ceramic double panel
Material：Ceramics Double panel
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Ceramic single panel
Material：Ceramics Single panel