深圳精科裕隆电子有限公司
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FR4-TG135 circuit board
Surface treatment method：Immersion Gold laminate：8L dielectric constant：4.3 thickness：1.6MM Outer copper foil thickness...
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FR4-TG135 circuit board
Surface treatment method：lead free laminate：2L dielectric constant：4.3 thickness：1.6MM Outer copper foil thickness：1oz ...
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FR4-TG150 circuit board
Surface treatment method：Immersion Gold laminate：4L dielectric constant：4.3 thickness：1.0MM Outer copper foil thickness...
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FR4-TG170 circuit board
Surface treatment method：Immersion Gold laminate：6L dielectric constant：4.3 thickness：1.6MM Outer copper foil thickness...
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FR4-TG170 circuit board
Surface treatment method：Immersion Gold laminate：4L dielectric constant：4.3 thickness：1.6MM Outer copper foil thickness...
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FR4-TG135 circuit board
Surface treatment method：Immersion Gold laminate：2L dielectric constant：4.3 thickness：0.6MM Outer copper foil thickness...
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FR4-TG150 circuit board
Surface treatment method：Immersion Gold laminate：2L dielectric constant：4.3 thickness：1.2MM Outer copper foil thickness...
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FR4-TG170 circuit board
Surface treatment method：Immersion Gold laminate：4L dielectric constant：4.3 thickness：1.0MM Outer copper foil thickness...