深圳精科裕隆电子有限公司
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FR4-TG135 circuit board
Surface treatment method：lead free laminate：2L dielectric constant：4.3 thickness：1.6MM Outer copper foil thickness：2oz ...
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FR4-TG150 circuit board
Surface treatment method：lead free laminate：4L dielectric constant：4.3 thickness：1.6MM Outer copper foil thickness：1oz ...
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FR4-TG150 circuit board
Surface treatment method：lead free laminate：4L dielectric constant：4.3 thickness：1.6MM Outer copper foil thickness：1oz ...
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FR4-TG150 circuit board
Surface treatment method：lead free laminate：2L dielectric constant：4.3 thickness：1.6MM Outer copper foil thickness：2oz ...
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Double-sided FR4 board
Layers：Double sided Material：FR4
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Spray tin black oil board
Surface treatment: Tin spray Material：FR4
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Four-layer through-hole board
Layers：4 Material：FR4 Surface treatment: Gold deposit Minimum aperture：0.15mm Line width/line spacing：0.2mm BGA（Ball Gri...
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6-layer Gold deposit
Layers：6 Material：FR4 Surface treatment: Gold deposit Minimum aperture：0.3mm