| Project | Project name | Process Capability |
|---|---|---|
| Overall process capability | Layers | 1-30 layers |
| High Frequency Hybrid HDI | Ceramic materials and PTFE materials can only be mechanically drilled for blind buried holes, controlled depth drilling, back drilling, etc. (laser drilling is not allowed, and copper foil cannot be directly pressed) | |
| High-speed HDI | Made as regular HDI | |
| Laser order | Levels 1-5 (≥6 levels require review) | |
| Plate thickness range | 0.1-5.0mm (less than 0.2mm, more than 6.5mm to be reviewed) | |
| Minimum finished product size | Veneer 5*5mm (less than 3mm to be reviewed) | |
| Maximum finished product size | 2-20 floors 21*33inch; Note: if the short edge of the board edge exceeds 21inch, it needs to be reviewed. | |
| Maximum finished copper thickness | Outer layer 8oz (larger than 8oz to be reviewed), inner layer 6oz (larger than 6oz to be reviewed) | |
| Minimum finished copper thickness | 1/2oz | |
| Interlayer alignment | ≤3mil | |
| Through hole filling range | Plate thickness ≤ 0.6mm, hole diameter ≤ 0.2mm | |
| Thickness range of resin plug orifice plate | 0.254-6.0mm, PTFE plate resin plug hole needs to be reviewed. | |
| Plate thickness tolerance | Plate thickness ≤ 1.0mm; ±0.1mm | |
| Plate thickness ＞ 1.0mm; ±10% | ||
| Impedance tolerance | ±5Ω（＜50Ω），±10%（≥50Ω）； ± 8% (≥ 50 Ω, to be reviewed) | |
| Warpage | Routine: 0.75%, limit: 0.5% (to be reviewed) maximum: 2.0% | |
| Pressing times | Pressing of the same core plate ≤ 5 times (more than 3 times need to be reviewed) | |
| Material type | Ordinary TG FR4 | Shengyi S1141, Jiantao kb6160a, Guoji gf212 |
| Medium TG FR4 | Shengyi s1150g (medium TG plate), Jiantao kb6165f, Jiantao kb6165g (halogen free) | |
| High Tg FR4 | Shengyi s1165 (halogen-free), Jiantao kb6167g (halogen-free), Jiantao kb6167f | |
| Aluminum substrate | Guoji gl12, clear cs-al-88/89 ad2, Juqin jq-143 1-8 mixed pressure FR-4 | |
| Type of material used for HDI board | Ldpp (it-180a 1037 and 1086), general 106 and 1080 | |
| High CTI | Shengyi s1600 | |
| High Tg FR4 |
Isola：FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR；联茂：IT-180A、 IT-150DA； Nelco：N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI；松下:R-5775K（Megtron6）、R-5725（Megtron4）；建滔：KB6167F； 台光：EM-827； 宏仁：GA-170；南亚：NP-180；台耀：TU-752、TU-662； 日立：MCL-BE-67G（H）、MCL-E-679（W）、 MCL-E-679F（J）；腾辉：VT-47； |
|
| Ceramic powder filled high frequency materials | Rogers：Rogers4350、Rogers4003;Arlon:25FR、25N; | |
| Polytetrafluoroethylene high frequency material | Rogers series、Taconic series、Arlon series、Nelco series、TP series | |
| PTFE semi cured sheet | Taconic：TP series、TPN series、HT1.5(1.5mil)、Fastrise series | |
| Mixed pressure of materials | Rogers、Taconic、Arlon、Nelco and FR-4 | |
| Metal substrate | Number of layers | Aluminum substrate and copper substrate: 1-8 layers; Cold plate, sintered plate, embedded metal plate: 2-24 layers; Ceramic plate: 1-2 layers; |
| Finished product size (aluminum substrate, copper substrate, cold plate, sintered plate, embedded metal plate) | MAX:610*610mm、MIN:5*5mm | |
| Maximum production size (ceramic plate) | 100*100mm | |
| Finished plate thickness | 0.5-5.0mm | |
| Copper thickness | 0.5-10 OZ | |
| Metal base thickness | 0.5-4.5mm | |
| Metal based material | AL：1100/1050/2124/5052/6061；Copper：Red copper pure iron | |
| Minimum finished hole diameter and tolerance | NPTH：0.5±0.05mm；PTH(Aluminum substrate, copper substrate)：0.3±0.1mm；PTH(Cold plate, sintered plate, embedded metal plate)：0.2±0.10mm； | |
| Profile machining accuracy | ±0.2mm | |
| Surface treatment process of PCB part | Lead / non lead tin spraying; OSP； Nickel (palladium) gold precipitation; Electric (nickel) soft / hard gold; Electroplated tin; Nickel free electroplating of soft and hard gold; Thick gold production | |
| Metal surface treatment | Copper: nickel plated gold; Aluminum: anodic oxidation, hard oxidation, chemical passivation; Mechanical treatment: dry sand blasting and wire drawing. | |
| Metal based materials | Quanbao aluminum substrate (T-110, t-111); Tenghui aluminum substrate (vt-4a1, vt-4a2, vt-4a3); Laird aluminum substrate (1ka04, 1ka06); Bages metal substrate (mp06503, ht04503); Taconic metal substrate (tly-5, tly-5f); | |
| Thickness of thermal conductive adhesive (dielectric layer) | 75-150um | |
| Size of buried copper block | 3*3mm—70*80mm | |
| Flatness of buried copper block (drop accuracy) | ±40um | |
| Distance from buried copper block to hole wall | ≥12mil | |
| Thermal conductivity | 0.3-3W/m.k（Aluminum substrate, copper substrate, cold plate）；8.33W/m.k（Sintered plate）；0.35-30W/m.k（Buried metal plate）；24-180W/m.k（Ceramic plate）； | |
| Product type | Rigid plate | Backplane, HDI, multilayer buried blind hole, thick copper plate, thick copper for power supply, semiconductor test board |
| Stacking mode | Multiple pressing blind buried orifice plate | Pressing on the same side ≤ 3 |
| HDI board type | 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (embedded hole in n ≤ 0.3mm), laser blind hole can be electroplated and filled | |
| Local mixed pressure | Minimum distance from mechanical drilling to conductor in local mixed pressure area | ≤ 10 layers: 14mil; 12 floors: 15mil; ＞ 12th floor: 18mil |
| Minimum distance from local mixed pressure junction to borehole | ≤ 12 layers: 12mil; ＞ 12th floor: 15mil | |
| Surface treatment | Unleaded | Electroplating copper nickel gold, gold precipitation, hard gold plating (with / without nickel), gold finger, lead-free tin spraying, OSP, chemical nickel palladium, soft gold plating (with / without nickel), silver precipitation, tin precipitation, enig+osp, enig+g/f, full plate gold plating +g/f, silver precipitation +g/f, tin precipitation +g/f |
| Lead | Lead spray tin | |
| Thickness diameter ratio | 10: 1 (lead / lead-free tin spraying, chemical precipitation of nickel gold, silver, tin, chemical nickel palladium); 8：1（OSP） | |
| Machining dimension (max) | Gold deposition: 520*800mm, vertical tin deposition: 500*600mm, horizontal tin deposition: less than 500mm on one side; Horizontal silver deposition: less than 500mm on one side; Lead / lead-free tin spraying: 520*650mm; OSP: single side less than 500mm; Electroplated hard gold: 450*500mm; One side is not allowed to exceed 520mm | |
| Machining dimension (min) | Tin deposition: 60*80mm; Silver deposit: 60*80mm; Lead / lead-free tin spraying: 150*230mm; OSP：60*80mm； At the surface of the walking board less than the above size | |
| Thickness of processed plate | Gold sinking: 0.2-7.0mm, tin sinking: 0.3-7.0mm (vertical tin sinking line), 0.3-3.0mm (horizontal line); Silver deposit: 0.3-3.0mm; Lead / lead-free tin spraying: 0.6-3.5mm; Tin spray plates below 0.4mm need to be reviewed and manufactured; OSP：0.3-3.0mm； Electroplated hard gold: 0.3-5.0mm (plate thickness ratio 10:1) | |
| Minimum spacing between IC of gold plate or pad to line | 3mil | |
| Maximum height of golden finger | 1.5inch | |
| Minimum spacing between golden fingers | 6mil | |
| Minimum segment spacing of segmented golden finger | 7.5mil | |
| Surface coating thickness | Tin spraying | 2-40um (the thinnest thickness of the large tin surface with lead spraying is 0.4um, and the thinnest thickness of the large tin surface without lead spraying is 1.5um) |
| OSP | Film thickness: 0.2-0.4um | |
| Chemical precipitation of nickel and gold | Nickel thickness: 3-5um; Gold thickness: 1-3uinch, ≥ 3uinch needs to be reviewed | |
| Chemical precipitation of silver | 6-12uinch | |
| Chemical precipitation of tin | Tin thickness ≥ 1um | |
| Electroplate hard gold | 2-50uinch | |
| Electroplated soft gold | Gold thickness 0.10-1.5um (dry film plating process), gold thickness 0.10-4.0um (non dry film plating process) | |
| Chemical nickel palladium | NI:3-5um，Pd：1-6uinch，Au：1-4uinch | |
| Electroplating copper nickel gold | The thickness of gold is 0.025-0.10um, the thickness of nickel is ≥ 3um, and the thickness of base copper is 1oz at most | |
| Gold finger nickel plated gold | Gold thickness 1-50uinch (the required value refers to the thinnest point), Nickel thickness ≥ 3um | |
| Carbon oil | 10-50μm | |
| Green oil | Copper cover oil (10-18um), through hole cover oil (5-8um), line corner ≥ 5um (primary printing, copper thickness less than 48um) | |
| Blue gum | 0.20-0.80mm | |
| Drill hole | Maximum plate thickness of 0.1/0.15/0.2mm mechanical drilling | 0.8mm/1.5mm/2.5mm |
| Minimum laser drilling hole diameter | 0.1mm | |
| Maximum laser drilling aperture | 0.15mm | |
| Mechanical hole diameter (finished product) | 0.10-6.2mm (corresponding to drilling tool 0.15-6.3mm) | |
| The minimum finished hole diameter of PTFE material (including mixed pressure) plate is 0.25mm (corresponding to drill tool 0.35mm) | ||
| Hole diameter of mechanical buried blind hole ≤ 0.3mm (corresponding to drilling tool 0.4mm) | ||
| Hole diameter of green oil plug hole in disc hole ≤ 0.45mm (corresponding to drill tool 0.55mm) | ||
| The minimum hole diameter of connecting hole is 0.35mm (corresponding to 0.45mm of drilling tool) | ||
| The minimum diameter of metallized half hole is 0.30mm (corresponding to 0.4mm of drilling tool) | ||
| Maximum thickness diameter ratio of through-hole plate | 20: 1 (excluding tool diameter ≤ 0.2mm; > 12:1 to be evaluated) | |
| Maximum ratio of laser drilling depth to aperture | 1：1 | |
| Mechanical depth control drill has the largest blind hole depth to hole diameter ratio | 1.3:1 (aperture ≤ 0.20mm), 1.15:1 (aperture ≥ 0.25mm) | |
| Minimum depth of mechanical depth control drill (back drill) | 0.2mm | |
| Drilling - minimum distance from mechanical drilling to conductor (non buried blind hole plate and first-order laser blind hole) | 5.5mil (≤ 8 layers); 6.5mil（10-14）； 7mil (> 14 floors) | |
| Drilling - minimum distance from mechanical drilling to conductor (mechanical buried blind hole plate and second-order laser buried blind hole) | 7mil (primary pressing); 8mil (secondary pressing); 9MIL (three times of pressing) | |
| Drilling - minimum distance from mechanical drilling to conductor (laser blind hole) | 7mil（1+N+1）； 8mil (1+1+n+1+1 or 2+n+2) | |
| Drilling - minimum distance from laser drilling to conductor (1st and 2nd order HDI board) | 5mil | |
| Drilling - minimum distance between hole walls of different networks (after compensation) | 10mil | |
| Drilling - minimum distance between the hole walls of the same network (after compensation) | 6mil(通孔；激光盲孔)；10mil（机械盲埋孔） | |
| Drilling - minimum distance between non-metallic hole walls (after compensation) | 8mil | |
| Drilling hole position tolerance (compared with CAD data) | ±2mil | |
| Drilling - minimum tolerance of npth hole diameter | ±2mil | |
| Drilling - hole diameter accuracy of solderless devices | ±2mil | |
| Drilling - taper hole depth tolerance | ±0.15mm | |
| Drilling - taper hole orifice diameter tolerance | ±0.15mm | |
| Pad (ring) | Minimum size of inner and outer pads of laser hole | 10mil (4mil laser hole), 11mil (5MIL laser hole) |
| The size of inner and outer pads of mechanical via is the smallest | 16mil (8mil aperture) | |
| BGA pad diameter minimum | There are lead tin spraying process 10mil, lead-free tin spraying process 12mil, and other processes 7mil | |
| Pad tolerance (BGA) | +/-1.2mil (pad ＜ 12mil)+/- 10% (pad ≥ 12mil) | |
| Line width / spacing | Limit line width corresponding to copper thickness |
|
| 1/2OZ：3/3mil | ||
| 1OZ: 3/4mil | ||
| 2OZ: 5/5mil | ||
| 3OZ: 7/7mil | ||
| 4OZ: 12/12mil | ||
| 5OZ: 16/16mil | ||
| 6OZ: 20/20mil | ||
| 7OZ: 24/24mil | ||
| 8OZ: 28/28mil | ||
| 9OZ: 30/30mil | ||
| 10OZ: 32/30mil | ||
| Line width tolerance | ≤10mil：+/-1.0mil | |
| ＞10mil：+/-1.5mil | ||
| Solder resist character | Maximum drilling diameter of resistance welding plug hole (cover oil on both sides) | 0.5mm |
| Solder resist ink color | Green, yellow, black, blue, red, white, purple, matte green, matte oil black, high refraction white oil | |
| Character ink color | White, yellow, black | |
| Maximum diameter of blue glue aluminum plug hole | 5mm | |
| Resin plug hole drilling hole diameter range | 0.1-1.0mm | |
| Maximum thickness diameter ratio of resin plug hole | 12：1 | |
| Minimum width of resistance welding Bridge | Special requirements for green oil 4mil and variegated 6mil controlled solder bridge | |
| Minimum character line width | White characters 3mil high 24mil; Black character 5MIL high 32mil | |
| Minimum spacing of hollow words | Hollow width 8mil height 40mil | |
| Solder mask hollow word | Hollow width 8mil height 40mil | |
| appearance | Distance from the center line of V-CUT without copper leakage to the figure | H ≤ 1.0mm:0.3mm (20 ° refers to the angle of V-shaped incision), 0.33mm (30 °), 0.37mm (45 °); |
| 1.0＜H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°); | ||
| 1.6＜H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°); | ||
| 2.4＜H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°); | ||
| V-CUT symmetry tolerance | ±4mil | |
| The number of V-CUT lines is the largest | 100 | |
| V-CUT angle tolerance | ± 5 degrees | |
| V-CUT angle specification | 20、30、45 degrees | |
| Chamfer angle of golden finger | 20、30、45 degrees | |
| Chamfer angle tolerance of gold finger | ±5degrees | |
| The minimum distance between tab and golden finger without falling injury | 6mm | |
| Minimum distance between the side of golden finger and the contour edge line | 8mil | |
| Depth accuracy (npth) of deep milling groove (edge) | ±0.10mm | |
| Overall dimension accuracy (edge to edge) | ±8mil | |
| Minimum tolerance of milling groove hole (PTH) | Groove width and groove length are ± 0.15mm | |
| Minimum tolerance of milling groove and hole (npth) | Groove width and groove length are ± 0.10mm | |
| Minimum tolerance for slotted holes (PTH) | Groove width direction ± 0.075mm; Slot length / slot width < 2: Groove length direction +/-0.1mm; Slot length / slot width ≥ 2: slot length direction +/-0.075mm | |
| Minimum tolerance for slotted holes (npth) |
Groove width direction ± 0.05mm; Slot length / slot width < 2: Slot length direction +/-0.075mm; Slot length / slot width ≥ 2: slot length direction +/-0.05mm |
