Process capability
| Project | Content | Remarks |
| Product process | 1-12 layer board /fpc flexible circuit board, soft and hard combination board, tinplate, gold-plated board, gold-plated board |
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| Maximum size of plate | 250mm*700mm |
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| Maximum plate thickness | 0.45±0.05 |
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| Minimum plate thickness | 0.051~0.185 ±0.03 |
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| Thickness of base material copper foil | 1/3oz、1/2oz、1oz |
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| Minimum aperture | Finished aperture：0.08mm |
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| Minimum line width and line spacing | Minimum line width：0.05mm、Minimum line spacing：0.05mm |
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| Tolerance | Wire hole ± 10%, hole diameter +3mil, shape ± 0.05mm |
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| Coating thickness |
Gold plated plate: Ni layer thickness: 1-6um, Au layer thickness: 0.03-0.1um" Gold plate: thickness of Ni layer: 1-6um, thickness of Au layer: 0.03-0.2um“ Tinplate: SN layer thickness: 8-25um |
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Application scope of substrate
| Category | Brand | Specifications | Place of Origin |
| Base material | Xinyang / Shengyi | Adhesive free substrate, halogen-free | Taiwan |
| Substrate / covering film | Tai Hong | Adhesive base material, adhesive free base material, halogen-free | Taiwan |
| Substrate / covering film | Generous and benevolent | Adhesive base material, halogen-free | Taiwan |
| Substrate / covering film | Yasen | Adhesive base material, adhesive free base material, halogen-free | Taiwan |
| Gummed paper | 3M | 3M9077、9460、467、468 | U.S.A |
| Gummed paper | Ridong | 5919 high temperature resistance | Japan |
| Gummed paper | SONY | D3410 heat curing adhesive | Japan |
Process capability
| Project | Technical capability | Project | Tolerance |
| Number of layers | 1-12 layers of FPC (2-12 layers of soft and hard bonding plate) | Lamination tolerance of covering film | ±0.2mm |
| Maximum mosaic size | 250*900mm (500*1200mm special) | PI reinforcement includes FR4 | ±0.2mm |
| Minimum aperture | 0.1mm | Punching burr of covering film | ≤0.1mm |
| Bottom copper thickness | 12um/18um/35um/70um | Electromagnetic film alignment tolerance | ±0.35mm |
| Insulation thickness | 12.5um/25um/50um | Steel sheet reinforcement tolerance | 0.1mm |
| Minimum plate thickness | 0.09 | Misalignment tolerance between reinforcing plate hole and FPC hole | ≤0.05mm |
| Minimum line width and line spacing | 0.045 | Drilling tolerance | ≤0.02mm |
| Line tolerance | ±0.02mm | Thickness tolerance of single panel gold deposit | 1-2um |
| Profile tolerance (edge to edge) | Precision mold ± 0.05mm/ ordinary mold ± 0.1mm | Thickness tolerance of single panel nickel deposition | 0.025-0.075um |
| Nickel gold plating thickness | 1-3um | Thickness tolerance of gold deposit of double-sided plate | 2-3um |
| Thickness of chemical precipitation nickel gold | 0.02-0.075um | Thickness tolerance of gold and nickel on double-sided plate | 0.025-0.075um |
| Wire to profile edge | 0.05mm | Tolerance of etched steel sheet | ±0.03mm |
| Thickness of electroplated pure tin | 1-15um | Tolerance of punching steel sheet |
±0.05mm |
