Workshop A5, Xin Bao Industrial Zone, building C, Shenzhen
szjklsm_pcb@163.com / mkt@szjkyl-pcb.com
0755-27338957 / 18682274874
English
中文
English
Home
About US
Advantage
Productivity
PCB process capability
FPC process capability
Product
Material
Craft
Structure
Plate Thickness/Co...
Case
Communication field
Medical field
Science and Technology Ed...
Security field
Smart appliances
Patch
news
Company press
Industry news
Certificate of honor
Service
Contact
contact us
Online Message
Current Position：
Home
>
Product Center
>
Product Center
Material
FR4 board
High frequency board
Copper base
Aluminum base
Iron base
Glass base
Ceramics
Craft
Half hole plate
Metal edging
Counterbore
OSP + gold deposit
Gold deposit + electric gold
Electric thick gold
Control deep gong
Structure
Single / double sided
Multi-storey
HDI
FR4 + high frequency board
Soft hard combination
Plate Thickness/Copper...
Ultra thin plate
Thick plate
Thick copper plate
24-hour hotline：
0755-27338957
18682274874
混合压层pcb电路板
层 数：4层
材 质：FR-4
表面处理：沉金
最小钻孔：0.15mm
最小线宽：0.065mm
最小线距：0.065mm
在PCB的制造中，压合工艺通常是指，将铜箔、半固化片和己做好线路的芯板（内层），按一定顺序叠合，然后经由压机，先热压...
【Details】
First
Prev
1
Next
Last
0755-27338957
