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  • FR4-TG135 circuit board
FR4-TG135 circuit board
Surface treatment method:lead free
laminate:2L
dielectric constant:4.3
thickness:1.6MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:/Minimum aperture:0.2MM Minimum line width/line spacing:0.15MM/0.15MM

FR4-TG135 circuit board

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