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FR4-TG150 circuit board
Surface treatment method:Immersion Gold
laminate:6L
dielectric constant:4.3
thickness:1.6MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:1ozMinimum aperture:0.2MM Minimum line width/line spacing:0.075MM/0.075MM

FR4-TG150 circuit board

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