FR4-TG170 circuit board

Surface treatment method：Immersion Gold
laminate：4L
dielectric constant：4.3
thickness：1.6MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：1ozMinimum aperture：0.2MM Minimum line width/line spacing：0.1MM/0.1MM

【Details】

FR4-TG135 circuit board

Surface treatment method：Immersion Gold
laminate：2L
dielectric constant：4.3
thickness：0.6MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：/Minimum aperture：0.15MM Minimum line width/line spacing：0.1MM/0.1MM

【Details】

FR4-TG150 circuit board

Surface treatment method：Immersion Gold
laminate：2L
dielectric constant：4.3
thickness：1.2MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：/Minimum aperture：0.2MM Minimum line width/line spacing：0.1MM/0.1MM

【Details】

FR4-TG170 circuit board

Surface treatment method：Immersion Gold
laminate：4L
dielectric constant：4.3
thickness：1.0MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：1ozMinimum aperture：0.2MM Minimum line width/line spacing：0.1MM/0.1MM

【Details】

FR4-TG135 circuit board

Surface treatment method：lead free
laminate：2L
dielectric constant：4.3
thickness：1.6MM
Outer copper foil thickness：2oz
Inner layer copper foil thickness：/Minimum aperture：0.5MM Minimum line width/line spacing：0.3MM/0.3MM

【Details】

FR4-TG150 circuit board

Surface treatment method：lead free
laminate：4L
dielectric constant：4.3
thickness：1.6MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：1ozMinimum aperture：0.3MM Minimum line width/line spacing：0.25MM/0.25MM

【Details】

FR4-TG150 circuit board

Surface treatment method：lead free
laminate：4L
dielectric constant：4.3
thickness：1.6MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：1ozMinimum aperture：0.3MM Minimum line width/line spacing：0.2MM/0.15MM

【Details】

FR4-TG150 circuit board

Surface treatment method：lead free
laminate：2L
dielectric constant：4.3
thickness：1.6MM
Outer copper foil thickness：2oz
Inner layer copper foil thickness：/ Minimum aperture：0.5MM Minimum line width/line spacing：0.35MM/0.35MM

【Details】

Double-sided FR4 board

Layers：Double sided
Material：FR4

【Details】

Spray tin black oil board

Surface treatment: Tin spray
Material：FR4

【Details】

Four-layer through-hole board

Layers：4
Material：FR4
Surface treatment: Gold deposit
Minimum aperture：0.15mm

Line width/line spacing：0.2mm
BGA（Ball Grid Array）

【Details】

6-layer Gold deposit

Layers：6
Material：FR4
Surface treatment: Gold deposit
Minimum aperture：0.3mm

【Details】