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FR4-TG170 circuit board

FR4-TG170 circuit board

Surface treatment method:Immersion Gold
laminate:4L
dielectric constant:4.3
thickness:1.6MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:1ozMinimum aperture:0.2MM Minimum line width/line spacing:0.1MM/0.1MM
【Details】
FR4-TG135 circuit board

FR4-TG135 circuit board

Surface treatment method:Immersion Gold
laminate:2L
dielectric constant:4.3
thickness:0.6MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:/Minimum aperture:0.15MM Minimum line width/line spacing:0.1MM/0.1MM
【Details】
FR4-TG150 circuit board

FR4-TG150 circuit board

Surface treatment method:Immersion Gold
laminate:2L
dielectric constant:4.3
thickness:1.2MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:/Minimum aperture:0.2MM Minimum line width/line spacing:0.1MM/0.1MM
【Details】
FR4-TG170 circuit board

FR4-TG170 circuit board

Surface treatment method:Immersion Gold
laminate:4L
dielectric constant:4.3
thickness:1.0MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:1ozMinimum aperture:0.2MM Minimum line width/line spacing:0.1MM/0.1MM
【Details】
FR4-TG135 circuit board

FR4-TG135 circuit board

Surface treatment method:lead free
laminate:2L
dielectric constant:4.3
thickness:1.6MM
Outer copper foil thickness:2oz
Inner layer copper foil thickness:/Minimum aperture:0.5MM Minimum line width/line spacing:0.3MM/0.3MM
【Details】
FR4-TG150 circuit board

FR4-TG150 circuit board

Surface treatment method:lead free
laminate:4L
dielectric constant:4.3
thickness:1.6MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:1ozMinimum aperture:0.3MM Minimum line width/line spacing:0.25MM/0.25MM
【Details】
FR4-TG150 circuit board

FR4-TG150 circuit board

Surface treatment method:lead free
laminate:4L
dielectric constant:4.3
thickness:1.6MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:1ozMinimum aperture:0.3MM Minimum line width/line spacing:0.2MM/0.15MM
【Details】
FR4-TG150 circuit board

FR4-TG150 circuit board

Surface treatment method:lead free
laminate:2L
dielectric constant:4.3
thickness:1.6MM
Outer copper foil thickness:2oz
Inner layer copper foil thickness:/ Minimum aperture:0.5MM Minimum line width/line spacing:0.35MM/0.35MM
【Details】
6oz thick copper plate

6oz thick copper plate

6oz thick copper plate









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5oz thick copper plate

5oz thick copper plate

5oz thick copper plate









【Details】
4oz thick copper plate

4oz thick copper plate

4oz thick copper plate









【Details】
3oz thick copper plate

3oz thick copper plate

3oz thick copper plate









【Details】
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