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FR4-TG170 circuit board

FR4-TG170 circuit board

Surface treatment method:Immersion Gold
laminate:4L
dielectric constant:4.3
thickness:1.6MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:1ozMinimum aperture:0.2MM Minimum line width/line spacing:0.1MM/0.1MM
【Details】
FR4-TG135 circuit board

FR4-TG135 circuit board

Surface treatment method:Immersion Gold
laminate:2L
dielectric constant:4.3
thickness:0.6MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:/Minimum aperture:0.15MM Minimum line width/line spacing:0.1MM/0.1MM
【Details】
FR4-TG150 circuit board

FR4-TG150 circuit board

Surface treatment method:Immersion Gold
laminate:2L
dielectric constant:4.3
thickness:1.2MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:/Minimum aperture:0.2MM Minimum line width/line spacing:0.1MM/0.1MM
【Details】
FR4-TG170 circuit board

FR4-TG170 circuit board

Surface treatment method:Immersion Gold
laminate:4L
dielectric constant:4.3
thickness:1.0MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:1ozMinimum aperture:0.2MM Minimum line width/line spacing:0.1MM/0.1MM
【Details】
FR4-TG135 circuit board

FR4-TG135 circuit board

Surface treatment method:lead free
laminate:2L
dielectric constant:4.3
thickness:1.6MM
Outer copper foil thickness:2oz
Inner layer copper foil thickness:/Minimum aperture:0.5MM Minimum line width/line spacing:0.3MM/0.3MM
【Details】
FR4-TG150 circuit board

FR4-TG150 circuit board

Surface treatment method:lead free
laminate:4L
dielectric constant:4.3
thickness:1.6MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:1ozMinimum aperture:0.3MM Minimum line width/line spacing:0.25MM/0.25MM
【Details】
FR4-TG150 circuit board

FR4-TG150 circuit board

Surface treatment method:lead free
laminate:4L
dielectric constant:4.3
thickness:1.6MM
Outer copper foil thickness:1oz
Inner layer copper foil thickness:1ozMinimum aperture:0.3MM Minimum line width/line spacing:0.2MM/0.15MM
【Details】
FR4-TG150 circuit board

FR4-TG150 circuit board

Surface treatment method:lead free
laminate:2L
dielectric constant:4.3
thickness:1.6MM
Outer copper foil thickness:2oz
Inner layer copper foil thickness:/ Minimum aperture:0.5MM Minimum line width/line spacing:0.35MM/0.35MM
【Details】
Ceramic 3006

Ceramic 3006

Material:Ceramics
Double panel







【Details】
Ceramic 3003

Ceramic 3003

Material:Ceramics
Double panel







【Details】
Ceramic double panel

Ceramic double panel

Material:Ceramics
Double panel







【Details】
Ceramic single panel

Ceramic single panel

Material:Ceramics
Single panel







【Details】
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