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18682274874
FR4-TG150 circuit board
Surface treatment method：Immersion Gold
laminate：6L
dielectric constant：4.3
thickness：1.2MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：1oz
Minimum aperture：0.2MM
Minimum line width/line spacing：0.1MM/0.1MM
【Details】
FR4-TG150 circuit board
Surface treatment method：Immersion Gold
laminate：4L
dielectric constant：4.3
thickness：0.8MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：1oz
Minimum aperture：0.25MM
Minimum line width/line spacing：0.12MM/0.1MM
【Details】
FR4-TG150 circuit board
Surface treatment method：Immersion Gold
laminate：6L
dielectric constant：4.3
thickness：1.6MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：1oz
Minimum aperture：0.2MM
Minimum line width/line spacing：0.075MM/0.075MM
【Details】
FR4-TG150 circuit board
Surface treatment method：Immersion Gold
laminate：2L
dielectric constant：4.3
thickness：1.6MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：/
Minimum aperture：0.2MM
Minimum line width/line spacing：0.1MM/0.1MM
【Details】
FR4-TG150 circuit board
Surface treatment method：Immersion Gold
laminate：2L
dielectric constant：4.3
thickness：1.6MM
Outer copper foil thickness：2oz
Inner layer copper foil thickness：/
Minimum aperture：0.4MM
Minimum line width/line spacing：0.25MM/0.25MM
【Details】
FR4-TG150 circuit board
Surface treatment method：Immersion Gold
laminate：4L
dielectric constant：4.3
thickness：1.6MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：1oz
Minimum aperture：0.2MM
Minimum line width/line spacing：0.1MM/0.1MM
【Details】
FR4-TG150 circuit board
Surface treatment method：Immersion Gold
laminate：4L
dielectric constant：4.3
thickness：0.8MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：1oz
Minimum aperture：0.2MM
Minimum line width/line spacing：0.1MM/0.1MM
【Details】
FR4-TG170 circuit board
Surface treatment method：Immersion Gold
laminate：4L
dielectric constant：4.3
thickness：1.0MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：1oz
Minimum aperture：0.2MM
Minimum line width/line spacing：0.075MM/0.075MM
【Details】
FR4-TG135 circuit board
Surface treatment method：Immersion Gold
laminate：8L
dielectric constant：4.3
thickness：1.6MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：/
Minimum aperture：0.2MM
Minimum line width/line spacing：0.1MM/0.1MM
【Details】
FR4-TG135 circuit board
Surface treatment method：lead free
laminate：2L
dielectric constant：4.3
thickness：1.6MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：/
Minimum aperture：0.2MM
Minimum line width/line spacing：0.15MM/0.15MM
【Details】
FR4-TG150 circuit board
Surface treatment method：Immersion Gold
laminate：4L
dielectric constant：4.3
thickness：1.0MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：1oz
Minimum aperture：0.2MM
Minimum line width/line spacing：0.1MM/0.1MM
【Details】
FR4-TG170 circuit board
Surface treatment method：Immersion Gold
laminate：6L
dielectric constant：4.3
thickness：1.6MM
Outer copper foil thickness：1oz
Inner layer copper foil thickness：1oz
Minimum aperture：0.2MM
Minimum line width/line spacing：0.075MM/0.075MM
【Details】
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